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Essentials of electronic packaging a multidisciplinary approach 1st Edition by Puligandla Viswanadham 0791859665 978-0791859667

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Essentials of electronic packaging a multidisciplinary approach 1st Edition Puligandla Viswanadham Digital Instant Download

Author(s): Puligandla Viswanadham, Dereje Agonafer
ISBN(s): 9780791859667, 0791859665
Edition: 1
File Details: PDF, 54.91 MB
Year: 2011
Language: english
SKU: EB-5892110 Category: Tags: ,

Essentials of electronic packaging a multidisciplinary approach 1st Edition by Puligandla Viswanadham – Ebook PDF Instant Download/Delivery: 0791859665, 978-0791859667
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Product details:

ISBN 10: 0791859665
ISBN 13: 978-0791859667
Author:  Pugligandla Viswanadham

ASME Press Book Series on Electronic Packaging. Series Editor: Dereje Agonafer. This book provides the basic essentials and fundamentals of electronic packaging technology. It introduces the language and terminology, as well as the basic building blocks of information processing technology such as: a) printed wiring boards and laminates, b) various types of components and packages, c) materials and processes, d) fundamentals of reliability and relevant reliability enhancement methods, and e) typical failures observed are described. A fully tested semiconductor device is the starting point for this text. Thus, no background in the semiconductor design or fabrication is assumed. The reader is exposed to the interaction and convergence of various disciplines such as chemistry, physics, materials science, metallurgy, process engineering in the fabrication of an electronic appliance. The reader is also made aware of the emerging trends in electronic packaging to prepare him or her for the near-term miniaturization and integration of technology trends.

Essentials of electronic packaging a multidisciplinary approach 1st Table of contents:

  1. Introduction
  2. Substrate and Laminate Technologies
  3. First-Level Packaging—Packaging and Component Technologies
  4. Package-to-Board Interconnection
  5. System Packaging
  6. Reliability of Electronic Packaging
  7. Failure Modes and Mechanisms
  8. Reliability Enhancements
  9. Emerging Trends in Packaging

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