Electromagnetic Compatibility Principles and Applications 2nd Edition by David Weston 0585428034 9780824788896

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Product details:

ISBN 10: 0585428034

ISBN 13: 9780824788896

Author: David A. Weston

This totally revised and expanded reference/text provides comprehensive, single-source coverage of the design, problem solving, and specifications of electromagnetic compatibility (EMC) into electrical equipment/systems-including new information on basic theories, applications, evaluations, prediction techniques, and practical diagnostic options for preventing EMI through cost-effective solutions.Offers the most recent guidelines, safety limits, and standards for human exposure to electromagnetic fields!Containing updated data on EMI diagnostic verification measurements, as well as over 900 drawings, photographs, tables, and equations-500 more than the previous edition-Electromagnetic Compatibility: Principles and Applications, Second Edition

Table of contents:

Chapter 1 Introduction to EMI and the Electromagnetic Environment
1.1 Introduction to electromagnetic interference (EMI)
1.2 Introduction to electromagnetic interference regulations
1.3 Electromagnetic environment
References

Chapter 2 Introduction to E and H, Near and Far Fields, Radiators, Receptors, and Antennas
2.1 Static and quasi-static fields
2.2 Electric waves on wires and in free space
2.3 Radiated power
2.4 Units of measurement
2.5 Receiving properties of an antenna
2.6 Simple, easily constructed E and H field antennas
2.7 Nonionizing electromagnetic field exposure safety limits
2.8 Computer programs
References

Chapter 3 Typical Sources and Characteristics of Radiated and Conducted Emissions
3.1 Introduction to noise sources
3.2 Fourier transform methods and computer programs
3.3 Case Study 3.1: Noise levels generated by dc-to-dc converters
3.4 Transmitter-generated noise
References

Chapter 4 Crosstalk and Electromagnetic Coupling Between PCB Tracks, Wires, and Cables
4.1 Introduction to crosstalk and electromagnetic coupling
4.2 Capacitive crosstalk and electric field coupling between wires and cables
4.3 Inductive crosstalk and magnetic field coupling between wires and cables
4.4 Combined inductive and capacitive crosstalk
References

Chapter 5 Components, Emission Reduction Techniques, and Noise Immunity
5.1 Components
5.2 Emission reduction techniques
5.3 Noise immunity
5.4 Transient protection
Addresses of manufacturers mentioned in this Chapter
References

Chapter 6 Electromagnetic Shielding
6.1 Reflection, absorption, and shielding effectiveness
6.2 Shielding effectiveness
6.3 New shielding materials: conductive paints and thermoplastics, plastic coatings, and glue
6.4 Seams, joints, ventilation, and other apertures
6.5 Gasketing theory, gasket transfer impedance, gasket type, and surface finish
6.6 Practical shielding and limitation on effectiveness
6.7 Compartmentalization
6.8 Shielding effectiveness of buildings
6.9 Computer program for evaluating shielding effectiveness
References

Chapter 7 Cable Shielding, Coupling from E and H Fields, and Cable Emissions
7.1 Introduction to cable coupling and emissions
7.2 Cable shielding effectiveness/transfer impedance
7.3 Shield termination effects on transferred voltage
7.4 Coupling from E and H fields
7.5 Shield termination
7.6 Emissions from cables and wires
7.7 Reduction in the emissions of E and H fields from cables
7.8 Shielded connectors, backshells, and other shield termination techniques
7.9 Practical level of shielding required to meet MIL-STD/DO-160C or commercial radiated emission requirements
References

Chapter 8 Grounding and Bonding
8.1 Introduction to grounding
8.2 Safety grounds, earth grounds, and large-system grounding
8.3 Signal ground and power ground
8.4 Guidelines for signal grounding
8.5 Power and grounding diagrams
8.6 Grounding for lightning protection
8.7 Bonding
References

Chapter 9 EMI Measurements, Control Requirements, and Test Methods
9.1 Introduction
9.2 Test equipment
9.3 Diagnostic measurements
9.4 Commercial EMI requirements and measurement
9.5 Shielded rooms, anechoic chambers, transmission lines, and cell antennas
9.6 Military EMI requirements and measurement techniques
9.7 RTCA/DO-160 requirements
References

Chapter 10 Systems EMC and Antenna Coupling
10.1 System-level EMC
10.2 Antenna-coupled EMI
10.3 Ambient site predictions and surveys
10.4 Case Study 10.3: Coupling into HV ac line from HF phased-array radar
References

Chapter 11 Printed Circuit Boards
11.1 Introduction
11.2 Principles of radiation from printed circuit boards
11.3 Low-level radiation PCB layout
11.4 Comparison of logic types
11.5 Circuit-level reduction techniques
11.6 PCB grounding
11.7 Shielding a printed circuit board
11.8 PCB radiation, crosstalk prediction, and CAD programs
11.9 PCB layout case studies
11.10 Increased printed circuit board immunity
References

Chapter 12 EMI and EMC Control, Case Studies, EMC Prediction Techniques, and Computational Electromagnetic Modeling
12.1 EMC control
12.2 EMI investigations
12.3 EMC predictions: general approach
12.4 EMC, computational electromagnetic modeling, and field solver computer programs
References

Appendix 1 Characteristic Impedance of Conductors, Wires, and Cables
Appendix 2 Units and Conversion Factors
Appendix 3 Electric Field Strength to Magnetic Field to Power Density Conversions
Appendix 4 Commonly Used Related Formulas
Appendix 5 Data on Bare Solid Copper Wire (Dimensions, Weight, and Resistance)

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