Materials and Failures in MEMS and NEMS 1st Edition by Atul Tiwari, Baldev Raj 9781119083603 1119083605
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Product details:
ISBN 10: 1119083605
ISBN 13: 9781119083603
Author: Atul Tiwari, Baldev Raj
The fabrication of MEMS has been predominately achieved by etching the polysilicon material. However, new materials are in large demands that could overcome the hurdles in fabrication or manufacturing process. Although, an enormous amount of work being accomplished in the area, most of the information is treated as confidential or privileged. It is extremely hard to find the meaningful information for the new or related developments. This book is collection of chapters written by experts in MEMS and NEMS technology. Chapters are contributed on the development of new MEMS and NEMS materials as well as on the properties of these devices. Important properties such as residual stresses and buckling behavior in the devices are discussed as separate chapters. Various models have been included in the chapters that studies the mode and mechanism of failure of the MEMS and NEMS. This book is meant for the graduate students, research scholars and engineers who are involved in the research and developments of advanced MEMS and NEMS for a wide variety of applications. Critical information has been included for the readers that will help them in gaining precise control over dimensional stability, quality, reliability, productivity and maintenance in MEMS and NEMS. No such book is available in the market that addresses the developments and failures in these advanced devices.
Table of contents:
Chapter 1: Carbon as a MEMS Material
Chapter 2: Intelligent Model-Based Fault Diagnosis of MEMS
Chapter 3: MEMS Heat Exchangers
Chapter 4: Application of Porous Silicon in MEMS and Sensors Technology
Chapter 5: MEMS/NEMS Switches with Silicon to Silicon (Si-to-Si) Contact Interface
Chapter 6: On the Design, Fabrication, and Characterization of cMUT Devices
Chapter 7: Inverse Problems in the MEMS/NEMS Applications
Chapter 8: Ohmic RF-MEMS Control
Chapter 9: Dynamics of MEMS Devices
Chapter 10: Buckling Behaviors and Interfacial Toughness of a Micron-Scale Composite Structure with a Metal Wire on a Flexible Substrate
Chapter 11: Microcantilever-Based Nano-Electro-Mechanical Sensor Systems: Characterization, Instrumentation, and Applications
Chapter 12: CMOS MEMS Integration
Chapter 13: Solving Quality and Reliability Optimization Problems for MEMS with Degradation Data
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Tags: Atul Tiwari, Baldev Raj, Materials, Failures