Thermal design of electronic equipment 1st Edition by Ralph Remsburg ISBN 0849300827 9780849300820

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ISBN 10: 0849300827 
ISBN 13: 9780849300820
Author: Ralph Remsburg

In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to gain as much understanding about the underlying mechanisms of fluid motion as possible.Thermal Design of Electronic Equipment is the only book that specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin (PAO), silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging.

Thermal design of electronic equipment 1st Table of contents:

Chapter 1 Introduction to Thermal Design of Electronic Equipment
1.1 Introduction to the Modes of Heat Transfer in Electronic Equipment
1.1.1 Convection
1.1.2 Conduction
1.1.3 Radiation
1.1.4 Practical Thermal Resistances
1.2 Theoretical Power Dissipation in Electronic Components
1.2.1 Theoretical Power Dissipation
1.2.2 Heat Generation in Active Devices
1.2.2.1 CMOS Devices
1.2.2.2 Junction FET
1.2.2.3 Power MOSFET
1.2.3 Heat Generated in Passive Devices
1.2.3.1 Interconnects
1.2.3.2 Resistors
1.2.3.3 Capacitors
1.2.3.4 Inductors and Transformers
1.3 Thermal Engineering Software for Personal Computers
1.3.1 Commercial CFD Codes
1.3.2 Flotherm v2.2
References
Chapter 2 Formulas for Conductive Heat Transfer
2.1 Conduction in Electronic Equipment: Introduction
2.2 Thermal Conductivity
2.2.1 Thermal Resistances
2.2.2 Conductivity In Solids
2.2.3 Conductivity In Fluids
2.3 Conduction—Steady State
2.3.1 Conduction in Simple Geometries
2.3.1.1 Conduction through a Plane Wall
2.3.1.2 Conduction through Cylinders and Spheres
2.3.1.3 Plane Wall with Heat Generation
2.3.1.4 Cylinders and Spheres with Heat Generation
2.3.1.5 Critical Radius of a Cylinder
2.3.2 Conduction in Complex Geometries
2.3.2.1 Multidimensional Analytic Method
2.3.2.2 Multidimensional Graphical Method
2.3.2.3 Multidimensional Shape Factor Method
2.3.2.4 Finite Difference Method
2.3.2.5 Resistance-Capacitance Networks
2.4 Conduction—Transient
2.4.1 Lumped Capacitance Method
2.4.2 Application of the Lumped Capacitance Method
2.5 Conduction in Extended Surfaces
2.5.1 Fin Efficiency
2.5.2 Fin Optimization
2.5.3 Fin Surface Efficiency
2.6 Thermal Contact Resistance in Electronic Equipment Interfaces
2.6.1 Simplified Contact Resistance Model
2.6.2 Geometry of Contacting Surfaces
2.6.3 Contact Resistance in a Typical Application
2.7 Discrete Heat Sources and Thermal Spreading
References
Chapter 3 Fluid Dynamics for Electronic Equipment
3.1 Introduction
3.2 Hydrodynamic Properties of Fluids
3.2.1 Compressibility
3.2.2 Viscosity
3.2.3 Surface Tension
3.3 Fluid Statics
3.3.1 Relationship of Pressure, Density, and Height
3.4 Fluid Dynamics
3.4.1 Streamlines and Flowfields
3.4.2 One-, Two-, and Three-Dimensional Flowfields
3.5 Incompressible Ideal Fluid Flow
3.5.1 One-Dimensional Flow
3.5.1.1 One-Dimensional Euler Equation
3.5.1.2 One-Dimensional Bernoulli Equation
3.5.1.3 Application of the One-Dimensional Equations
3.5.2 Two-Dimensional Flow
3.5.2.1 Application of the Two-Dimensional Equations
3.6 Incompressible Real Fluid Flow
3.6.1 Laminar Flow
3.6.2 Turbulence and the Reynolds Number
3.6.3 Boundary Layer Theory
3.6.4 Turbulent Flow
3.7 Loss Coefficients and Dynamic Drag
3.7.1 Expansions
3.7.2 Contractions
3.7.3 Tube Bends
3.7.4 Manifolds
3.7.5 Screens, Grills, and Perforated Plates
3.7.6 Rough Surface Conduits
3.8 Jets
3.9 Fans and Pumps
3.9.1 Fans
3.9.1.1 Fan Operation at Nonstandard Densities
3.9.2 Pumps
3.10 Electronic Chassis Flow
References
Chapter 4 Convection Heat Transfer in Electronic Equipment
4.1 Introduction
4.2 Fluid Properties
4.2.1 Properties of Air
4.3 Boundary Layer Theory
4.4 Dimensionless Groups
4.5 Forced Convection
4.5.1 Forced Convection Laminar Flow
4.5.1.1 Forced Convection Laminar Flow in Tubes
4.5.2 Forced Convection Turbulent Flow
4.5.2.1 Forced Convection Turbulent Flow in Tubes
4.5.2.2 Forced Convection Flow through Noncircular Tube Geometries
4.5.2.3 Forced Convection Flow through Tubes with Internal Fins
4.5.3 Forced Convection External Flow
4.5.3.1 Laminar Forced Convection along Flat Plates
4.5.3.2 Turbulent Forced Convection along Flat Plates
4.5.3.3 Mixed Boundary Layer Forced Convection along Flat Plates
4.5.3.4 Forced Convection Flow over Cylinders
4.5.3.5 Forced Convection Flow over Spheres
4.5.4 Forced Convection Flow Over Complex Bodies
4.5.4.1 Forced Convection Flow along a Populated Circuit Board
4.5.4.2 Forced Convection Flow through Pin-Fin Arrays
4.5.5 Jet Impingement Forced Convection
4.6 Natural Convection
4.6.1 Natural Convection Flow along Flat Plates
4.6.2 Natural Convection Cooling Using Vertical Fins
4.6.3 Natural Convection along Nonvertical Surfaces
4.6.4 Natural Convection in Sealed Enclosures
4.6.5 Natural Convection in Complex Geometries
4.6.5.1 Natural Convection across Horizontal Cylinders
4.6.5.2 Natural Convection along Vertical Cylinders
4.6.5.3 Natural Convection across Spheres
4.6.5.4 Natural Convection across Cones
4.6.5.5 Natural Convection across Horizontal Corrugated Plates
4.6.5.6 Natural Convection across Arbitrary Shapes
4.6.5.7 Natural Convection through U-Shaped Channels
4.6.5.8 Natural Convection through Pin-Fin Arrays
References
Chapter 5 Radiation Heat Transfer in Electronic Equipment
5.1 Introduction
5.1.1 The Electromagnetic Spectrum
5.2 Radiation Equations
5.3 Surface Characteristics
5.3.1 Emittance
5.3.1.1 Emittance Factor
5.3.1.2 Emittance from Extended Surfaces
5.3.2 Absorptance
5.3.3 Reflectance
5.3.3.1 Specular Reflectance
5.3.4 Transmittance
5.4 View Factors
5.4.1 Calculation of Estimated Diffuse View Factors
5.5 Environmental Effects
5.5.1 Solar Radiation
5.5.2 Atmospheric Radiation
References
Chapter 6 Heat Transfer with Phase Change
6.1 Introduction
6.1.1 Definitions of Phase Change Parameters
6.2 Dimensionless Parameters In Boiling and Condensation
6.3 Modes of Boiling Liquids
6.3.1 Bubble Phenomenon
6.3.2 Pool Boiling
6.3.2.1 Pool Boiling Curve
6.3.2.2 Pool Boiling Correlations
6.3.2.3 Pool Boiling Critical Heat Flux Correlations
6.3.2.4 Pool Boiling Minimum Heat Flux Correlations
6.3.2.5 Pool Boiling Vapor Film Correlations
6.3.3 Flow Boiling
6.3.3.1 External Forced Convection Boiling
6.3.3.2 Internal Forced Convection Boiling
6.4 Evaporation
6.5 Condensation
6.6 Melting and Freezing
References
Chapter 7 Combined Modes of Heat Transfer for Electronic Equipment
7.1 Introduction
7.2 Conduction in Series and in Parallel
7.3 Conduction and Convection in Series
7.4 Radiation and Convection in Parallel
7.5 Overall Heat Transfer Coefficient
Appendix

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